Susceptor pocket profile to improve process performance

ABSTRACT

An apparatus and method to position a wafer onto a wafer holder and to maintain a uniform wafer temperature is disclosed. The wafer holder or susceptor comprises a recess or pocket whose surface is concave and includes a grid containing a plurality of grid grooves separating protrusions. The concavity and grid grooves define an enclosed flow volume between a supported wafer and the susceptor surface, as well as an escape area, or total cross-sectional area of the grid grooves opening out from under the periphery of the wafer. These are chosen to reduce the wafer slide and curl during wafer drop-off and wafer stick during wafer pick-up, while improving thermal uniformity and reducing particle problems. In another embodiment, centering locators in the form of thin, radially placed protrusions are provided around the edge of the susceptor pocket to reduce further the possibility of contact between the wafer and the outer edge of the susceptor. These features help to achieve temperature uniformity, and therefore quality of the process result, across the wafer during processing.

REFERENCE TO RELATED APPLICATION

[0001] The present application is a divisional of and claims thepriority benefit under 35 U.S.C. § 121 from U.S. Application No.09/747,173 filed on Dec. 12, 2000, issued as U.S. Pat. No. ______,entitled “Susceptor Pocket Profile to Improve Process Performance,” thedisclosure of which is incorporated herein by reference.

FIELD OF THE INVENTION

[0002] The invention relates generally to susceptors for supportingsemiconductor substrates in process chambers, and, more particularly, toconfiguring wafer support surfaces to maintain uniform substratetemperature.

BACKGROUND AND SUMMARY OF THE INVENTION

[0003] Semiconductor fabrication processes are typically conducted withthe substrate supported within a chamber under controlled conditions.For many processes, semiconductor substrates (e.g., silicon wafers) areheated inside the process chamber. For example, substrates can be heatedby direct physical contact with a heated wafer holder and/or byradiation from a radiant heating source. “Susceptors,” for example, arewafer supports that absorb radiant heat and transmit absorbed heat tothe substrate.

[0004] In a typical process, a reactant gas is passed over the heatedwafer, causing the chemical vapor deposition (CVD) of a thin layer ofreactant material on the wafer. Through sequential processing, multiplelayers are made into integrated circuits. Other exemplary processesinclude sputter deposition, photolithography, dry etching, plasmaprocessing, and high temperature annealing. Many of these processesrequire high temperatures and can be performed in similar reactionchambers.

[0005] Various process parameters must be controlled carefully to ensurehigh quality in deposited films. One critical parameter is thetemperature of the wafer during the processing. During CVD, for example,there is a characteristic temperature range in which the process gasesreact most efficiently for depositing a thin film onto the wafer.Temperature control is especially critical at temperatures below themass transport regime, such as silicon CVD between about 500C and 900C(kinetic regime, about 500C to 900C for silicon CVD using silane). Inthis kinetic regime, if the temperature is not uniform across thesurface of the wafer, the deposited film thickness will be uneven.

[0006] In recent years, single-wafer processing of large diameter wafershas become more widely used for a variety of reasons, including the needfor greater precision in process control than can be achieved withbatch-processing. Typical wafers are made of silicon, most commonly witha diameter of about 150-mm (6 inches) or of about 200-mm (8 inches) andwith a thickness of about 0.725 mm. Recently, larger silicon wafers witha diameter of about 300 mm (12 inches) and a thickness of about 0.775 mmhave been introduced, as they exploit, even more efficiently, thebenefits of single-wafer processing. Even larger wafers are expected inthe future.

[0007] The inventor has found many quality control problems affectingyield result from handling issues associated with susceptors, includingsubstrate slide, stick and curl. These occur during placement andsubsequent removal of substrates in high temperature process chambers.

[0008] Slide occurs during drop off when a cushion of gas in thesusceptor recess or pocket is unable to escape fast enough to allow thesubstrate to fall immediately onto the susceptor. The substrate floatsmomentarily above the susceptor as the gas slowly escapes, and it tendsto slide off center. Thus, the substrate may not rest in the center ofthe pocket where it was intended, and uneven heating of the substratemay result. Sliding to the edge of a susceptor pocket causes localcooling where the substrate is in contact with the pocket edge andresults in poor thickness uniformity, poor resistivity uniformity andcrystallographic slip, depending on the nature of the layer beingdeposited. These non-uniformities, due to inconsistencies in the waferdrop position, greatly increase the difficulty in optimal tuning of theprocess. Similarly, non-uniformities in temperature can causenon-uniformities in etch, anneal, doping, oxidation, nitridation andother fabrication processes.

[0009] Conversely, during pickup, stick occurs when the substrate clingsto the underlying support because gas is slow to flow into the smallspace between the wafer and the surface of the pocket. This creates avacuum effect between the substrate and the support as the substrate islifted. Stick is a potential contributor to particle contamination and,in extreme cases, has caused lifting of the substrate holder on theorder of 1 to 2 mm.

[0010] Curl is warping of the substrate caused by a combination of bothradial and axial temperature gradients in the substrate. Severe curl cancause the substrate to contact the bottom side of a Bernoulli wand, andcan similarly affect interaction with other robot end effectors. In thecase of a Bernoulli wand, the top side of the substrate can scratch theBernoulli wand and cause particulate contamination, significantlyreducing yield. The design and function of a Bernoulli wand aredescribed in U.S. Pat. No. 5,997,588 and are included by referenceherein.

[0011]FIGS. 1A and 1B show a wafer 1 supported upon a susceptor 100,wherein the susceptor 100 has a gridded support surface G. Referringinitially to FIG. 1A, a portion of the wafer 1, close to a peripheraledge 2 thereof, is shown on the grid G. An upper surface of the grid Gis defined by a plurality of projections 3 separated from one another intwo dimensions by a plurality of grid grooves. These projections 3 arerecessed with respect to the upper surface of an annular shoulder 4surrounding the grid. For a 200-mm wafer, the depth of this recess orpocket is about 0.018 inches (0.457 mm), while the thickness of a 200-mmwafer is about 0.285 inches. Thus, the top surface of the wafer 11 risesslightly above the top surface of the shoulder 4, which helps tomaintain laminar gas flow over the wafer. An outer circumference 5 ofthe grid G is separated from an inner edge 6 of the shoulder 4 by anannular groove 7, which is approximately semicircular in cross section.The depth of annular groove 7 into the susceptor 100 is about the sameas the depth of the grid grooves. The diameter of the inner edge 6 ofthe shoulder 4 is slightly larger than the diameter of the wafer 1 toallow tolerance for positioning the wafer in the pocket. Similar griddedsusceptors are commercially available from ASM America, Inc. of Phoenix,Ariz. for use in its Epsilon™ series of CVD reaction chambers.

[0012] In FIG. 1A, the wafer 1 is centered over the pocket with equalspacing between wafer edge 2 and shoulder edge 6 all around the wafer.However, as shown in FIG. 1B, upon initial placement, the wafer 1 tendsto slide and/or jump, and its outer edge 2 often makes contact with orcomes in close proximity to the inner edge 6 of the shoulder 4. Theshoulder 4 is thicker and thus generally cooler than the wafer 1 and theunderlying grid G. As a result, the edge 2 of the wafer tends to cool byconduction. The wafer edge 2 will also lose heat through radiation if itis very near to the shoulder edge 6, even if they are not actually incontact.

[0013] Cooling at the wafer edge renders the temperature of the wafernon-uniform. Given that thin film deposition rates (and many otherfabrication processes) are strongly temperature dependent, especiallyfor CVD in the kinetic regime, film thickness, and resistivity, will benon-uniform across a wafer processed under conditions of temperaturenon-uniformity. Consequently, there is a need for an improved substratesupport that facilitates substrate pick-up and drop-off while promotingtemperature uniformity.

[0014] In satisfaction of this need and in accordance with one aspect ofthe invention, a substrate support is provided with a grid of groovesextending into a concave surface, which can hold a generally flatsubstrate, such as a silicon wafer, for processing. The concavity andgrooves are configured to minimize stick, slide and curl, while stillmaintaining desirable thermal properties. Methods for configuring thesupport and for supporting a substrate thereon are also provided.

[0015] In accordance with another aspect of the invention, centeringlocators, arranged radially along an inside edge of an annular shoulderof a substrate holder, are supplied. The centering locators establish adistance between the substrate and the annular shoulder to preventdirect thermal contact therebetween.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Further features and advantages of the present invention willbecome apparent from the detailed description of preferred embodimentsthat follow, when considered together with the attached drawings, whichare intended to illustrate and not to limit the invention.

[0017]FIG. 1A is a schematic cross-sectional view of a wafer centered ona susceptor.

[0018]FIG. 1B is a schematic cross-sectional of a wafer positioned offcenter on the susceptor of FIG. 1A.

[0019]FIG. 2 is a schematic, cross-sectional view of an exemplaryreaction chamber with a wafer supported on a susceptor therein.

[0020]FIG. 3A is a top plan view of a susceptor with a gridded pocketfor holding a wafer, constructed according to a preferred embodiment ofthe present invention.

[0021]FIG. 3B is a bottom plan view of the susceptor of FIG. 3A.

[0022]FIG. 3C is a partial cross-sectional view of the susceptor of FIG.3A taken along line 3C-3C of FIG. 3A.

[0023]FIG. 3D is an enlarged cross-sectional view of a portion of thesupport grid of FIG. 3C.

[0024]FIG. 4 is a schematic cross-sectional view of a portion of thesusceptor of FIG. 3A, with an exaggerated concavity in the pocketsurface to illustrate a preferred embodiment of the present invention.

[0025]FIG. 5 is a schematic cross-sectional drawing illustrating anenclosed volume between a supported wafer and the susceptor of FIG. 3A.

[0026]FIG. 6A is a schematic perspective and partially cut away view ofa wafer supported on the susceptor of FIG. 3C.

[0027]FIG. 6B is an enlarged cross-sectional view of the circled regionin FIG. 6A showing the support grid beneath a perimeter of the wafer.The cross section follows the curve of the wafer edge.

[0028]FIG. 7A is a perspective view of a portion of a susceptorconstructed in accordance with another embodiment of the inventionwherein the outer edge of a centering locator is in contact with thesusceptor shoulder.

[0029]FIG. 7B is a perspective view of a portion of a susceptorconstructed in accordance with an embodiment of the invention whereinthe outer edge of a centering locator is spaced inwardly from thesusceptor shoulder.

[0030]FIG. 8 is a schematic plan view of a wafer centered on a susceptorby a plurality of the locators of FIG. 7B.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0031] As noted in the Background and Summary section above, theinventor has found significant problems with respect to transfer ofsubstrates onto and from conventional substrate holders. In droppingsubstrates onto the holders, substrate slide makes it difficult toaccurately place the substrate in the center of the holder with goodreproducibility. When the holder is heated, particularly when the holderis a heated susceptor in a cold-wall reactor, a substrate dropped ontothe susceptor also tends to curl due to transitory temperaturedifferentials within the substrate. Curl can cause “jump” and move thesubstrate from its desired position. Due to unpredictable placement ofthe substrate upon the susceptor, it is difficult to accurately tune thetemperature control mechanisms for uniform heating of the substrate,especially for low temperature processes.

[0032] Furthermore, curl can cause scratching of the wafer-handling endeffector and dropping of the substrate, leading to particulatecontamination. In removing the wafer from the holder, the wafer tends tostick to the holder (known as “stiction”), sometimes lifts the susceptorand drops it back onto the supporting structure, thus causing furtherparticle generation. These particle problems can cause contamination ofwhole wafers, or even batches of wafers, significantly reducing yield.

[0033]FIG. 2 illustrates an exemplary chemical vapor deposition (CVD)reactor 10, including a quartz reaction chamber 12. Radiant heatingelements 14 are supported outside the quartz chamber 12, to provide heatenergy to the chamber 12 without appreciable absorption by the chamberwalls. Although the preferred embodiments are described in the contextof a “cold wall” CVD reactor, it will be understood that the wafersupport systems described herein also have utility in reactors of othertypes. In particular, one of skill in the art can find application forthe wafer support systems described herein for other semiconductorprocessing equipment, wherein a substrate is supported while beinguniformly heated or cooled. Moreover, while illustrated in the contextof standard silicon wafers, the supports described herein can be used tosupport other kinds of substrates, such as glass, which are subjected totreatments such as CVD, physical vapor deposition (PVD), etching,annealing, dopant diffusion, photolithography, etc. The supports are ofparticular utility for supporting substrates during treatment processesat elevated temperatures.

[0034] The illustrated substrate comprises a semiconductor wafer 16 witha generally circular edge 17, shown in FIG. 2 supported within thereaction chamber 12 upon a wafer support structure. The supportstructure includes a wafer holder or support 200, upon which the wafer16 rests, and a spider 22, preferably made of an insulating material,which supports the wafer holder 200. The spider 22 is mounted to a shaft24, which extends downwardly through a tube 26 depending from the lowerwall of the chamber. In the illustrated embodiment, the wafer holder 200comprises a susceptor capable of absorbing radiant energy from theheating elements 14. It is preferable that the upper surface of thesusceptor is solid and made of one piece.

[0035] A central temperature sensor or thermocouple 28 extends throughthe shaft 24 and the spider 22 in proximity to the wafer holder 200.Additional peripheral thermocouples 30 are also shown housed within aslip ring or temperature compensation ring 32, which surrounds the waferholder 200 and the wafer 16. The thermocouples 28, 30 are connected to atemperature controller (not shown), which sets the power of the variousheating elements 14 in response to the readings of the thermocouples 28,30.

[0036] In addition to housing the thermocouples 30, the slip ring 32absorbs radiant heat during high temperature processing. Thiscompensates for a tendency toward greater heat loss at the wafer edge17, a phenomenon that is known to occur due to a greater concentrationof surface area for a given volume near such edges. By minimizing edgelosses and the attending radial temperature non-uniformities across thewafer 16, the slip ring 32 can help to prevent crystallographic slip andother problems associated with temperature non-uniformities across thewafer. The slip ring 32 can be suspended by any suitable means. Forexample, the illustrated slip ring 32 rests upon elbows 34, which dependfrom the quartz chamber dividers 36.

[0037] With reference to FIGS. 3-6, the wafer holder of the preferredembodiment is shown. As noted above, the illustrated wafer holder is asusceptor 200 capable of absorbing radiant energy from the heatingelements 14. The susceptor 200 is preferably made of graphite coatedwith silicon carbide, although the skilled artisan will appreciate thatother materials are also suitable. The illustrated susceptor 200 is of atype considerably more massive than the wafer to be supported,preferably more than five times and more preferably between about 7 and9 times the thermal mass of the wafer, such that it can serve as a“thermal flywheel” to maintain temperature stability. Additionally, thesusceptor 200 is preferably “solid,” i.e., does not contain openingstherethrough. Such openings risk backside deposition as well as alterthermal properties.

[0038]FIG. 3A shows the susceptor 200 as viewed from the top, that is,looking into a recessed pocket 202 in which the wafer will be supported.The recessed pocket 202 has a set of perpendicular, crossing gridgrooves cut into its concave surface and surrounded by an annular groove204. These features will be described in more detail with respect toFIG. 3D below. While shown across only a portion of the susceptor pocket202, it will be appreciated that the grid extends across the fullsusceptor pocket 202 up to the annular groove 204. A raised shoulder 206circumscribes the annular groove 204. In an embodiment designed tosupport 200-mm wafers, for example, the diameter of the susceptor 200 tothe outer edge of the annular groove is about 8.000±0.005 inches, orslightly larger than the wafer which it is to support, and the overalldiameter of the susceptor is about 8.850±0.005 inches. The tops of thegrid protrusions along the circumference closest to the edge of thepocket define a plane on which the wafer rests, which is between about0.010 and 0.025 inch, more preferably between about 0.015 and 0.200 inchand most preferably about 0.018 inch below the top surface of theannular, raised shoulder 206, about 0.010 inch less than the thicknessof a standard 200-mm wafer.

[0039] A bottom plan view of the susceptor is shown in FIG. 3B. Thebottom surface 210 includes a bottom groove 214, about 0.250 inch inwidth and with a rectangular cross section, which forms a nearlycomplete concentric circle and has an outer diameter of about5.250±0.005 inches. The bottom groove 214 does not form a completecircle but is interrupted by a section 216, shown on the right side ofFIG. 3B. The illustrated interrupting section 216 has a length of about0.250 inch. The bottom groove 214 accepts fingers of the spider 22 (FIG.2) and the interrupting section 216 ensures that the spider 22 cannotrotate independently of the susceptor 200 once it has locked in positionagainst section 216.

[0040]FIG. 3C is a cross-sectional view of an area of the susceptor 200near the periphery along the line 3C-3C in FIG. 3A. On the top surface,the pocket 202 is shown with a plurality of grid protrusions 220separated by a plurality of parallel grid grooves 222, perpendicular tothe plane of the page. The skilled artisan will appreciate that there isa second set of similar, parallel grid grooves (not visible in thisview), perpendicular to the illustrated grid grooves 222 and parallel tothe plane of the page. Thus the protrusions 220 can be understood assmall, square islands, bordered on two parallel sides by one set of gridgrooves 222 and on the other two parallel sides by the second set ofgrid grooves not seen in this view. The annular groove 204, thesusceptor shoulder 206 and the relative positions thereof are alsoshown. On the bottom surface 210, the rectangular cross section ofbottom groove 214 is shown.

[0041]FIG. 3D is a detail of the pocket 202 surface shown in the circlelabeled 3D in FIG. 3C. Each grid groove 222 has a flat grid floor orbottom 224 and sidewalls 226 that slant outward and subtend an includedangle of 45°. The protrusions 220 between the grid grooves 222 have flattops 228 that define the support surface of the pocket 202. In theillustrated embodiment, the tops are square with a width and length ofabout 0.008 inch by 0.008 inch (0.20 mm by 0.20 mm), while the flatbottom portions 224 of the grid grooves 222 are about 0.221 inch (0.56mm) in width.

[0042] The difference in height between the protrusion top 228 and thegrid groove bottom 224 is preferably between about 0.35 mm and 0.55 mm,more preferably between about 0.40 mm and 0.45 mm (nominal 0.43 mm or0.017 inch in the illustrated embodiment). The pitch of the grid, ordistance between identical adjacent features, is preferably betweenabout 1.0 mm and 1.5 mm, more preferably between about 1.2 mm and 1.3 mmin both directions (nominally 1.27 mm or 0.050 inch in the illustratedembodiment).

[0043] Similar gridded susceptors have been available from ASM America,Inc. of Phoenix, Ariz. for use in the Epsilon™ series of CVD reactors.These susceptors, however, had different grid configurations. Forinstance, the pitch of the grid in prior susceptors was about half thatof the preferred embodiment. Furthermore, the prior susceptors weredesigned to be nearly planar, with the exception of a minimalmanufacturing tolerance for concavity (e.g., from 0 to 0.005 inch or0.127 mm), as compared to the peripheral portions of the grid, simply toavoid a convex shape. As detailed below with respect to FIG. 4, thepreferred embodiments feature a significant amount of concavity orbowl-shape for improved wafer handling.

[0044] With reference to FIG. 4, an upper portion of the susceptor 200is shown in cross section. The view extends from the centerline 240 ofthe susceptor to the annular shoulder 206. Only a portion of the annularshoulder 206 is shown. An upper surface 229 of the pocket 202 is definedby the top surfaces 228 of the grid protrusions 220. The upper surface229 slopes gradually downward from a peripheral grid protrusion 242 to acenter grid protrusion 244. Although it is not shown, it will beunderstood that the upper surface 229 also slopes upward from the centergrid protrusion 244 to another peripheral grid protrusion 220 at theother end of the pocket 202. The pocket 202 thus has circular symmetry,forming an overall concave shape. The concavity and grid structure ofthe susceptor pocket surface have been exaggerated for the purpose ofillustration.

[0045] The concavity of the upper surface 229 is defined by thedifference 246 in depth, relative to the top of the shoulder 206, forexample, between the top of a grid protrusion 242 on the periphery(adjacent to the annular groove 204) and the top of the grid protrusion244 (at the center 240 of the pocket 202). The concavity 246 ispreferably between about 0.130 mm and 0.500 mm. For susceptors designedfor 150-mm wafers, the concavity 246 is more preferably between about0.130 mm and 0.200 mm, and most preferably between about 0.130 mm and0.150 mm (nominally 0.1397 mm or 0.0055 inch in an exemplary 150-mmembodiment). For susceptors designed for 200-mm wafers, the concavity246 is more preferably between about 0.130 mm and 0.250 mm, and mostpreferably between about 0.170 mm and 0.220 mm (nominally 0.1905 mm or0.0075 inch in an exemplary 200-mm embodiment). For susceptors designedfor 300-mm wafers, the concavity 246 is more preferably between about0.300 mm and 0.500 mm, and most preferably between about 0.360 mm and0.400 mm. As the substrate size increases, the concavity is preferablyincreased more than proportionately.

[0046]FIG. 5 illustrates the wafer 16 in position in the pocket of thepreferred susceptor 200. The curvature and the grid structure of thepocket surface are exaggerated to illustrate the arrangement moreclearly. The volume “enclosed” between the wafer 16 and the underlyingsusceptor 200 is indicated by reference numeral 248 in FIG. 5 and isreferred to herein as the “flow volume,” as will be appreciated from thediscussion below. The enclosed flow volume 248 includes both the spacebetween the lower surface 249 of the wafer 16 and the upper surface 229of the grid, and the volume within the grid grooves 222 (i.e., thevolume between the lower surface 249 and the floors 224 of the gridgrooves 222).

[0047]FIG. 6A is a perspective view of the substrate or wafer 16 inposition on the susceptor 200 of the preferred embodiment. The cut-awayportion shows the edge 17 of the wafer 16 overlying protrusions 220 ator near the periphery of the susceptor pocket. The scale of the grid isexaggerated for the purpose of illustration.

[0048]FIG. 6B shows the wafer edge 17 in contact with the gridprotrusions 220 at the outer edge of the susceptor pocket and viewededge on. The grid is sectioned along a projection of the wafer edge orperimeter 17 downward into the grid. This projection intercepts aplurality of grid grooves 222, as shown. The cross section thus depictsthe openings of grid grooves 222 at the wafer edge 12. Gas (e.g., air orinert gas in the chamber) passes out through these openings during waferdrop-off and in through these openings during wafer pick-up.Accordingly, the sum of the cross-sectional areas of the grid grooves222 opening out from underneath the wafer 16 is referred to herein asthe “escape area” of the susceptor 200. The total escape area is the sumof all these areas around the circumference of the wafer through whichgas can escape as a wafer is dropped onto susceptor 200, or throughwhich gas can be drawn into the susceptor during wafer pick up.

[0049] The susceptor's enclosed flow volume and total escape area areoptimized to minimize wafer slide, stick and curl while maintaining goodthermal exchange properties and minimizing the risk of process gasesreaching the backside of the wafer. In preferred embodiments, theseparameters have been separately tailored for wafers with 6-inch or150-mm diameters, with 8-inch or 200-mm diameters and with 12-inch or300-mm diameters. For larger wafer sizes, the flow volume and totalescape area preferably increase more than proportionately to the waferareas because of the increased distance and increased volume of gastraveling to reach the wafer periphery.

[0050] As noted, the total enclosed flow volume includes the volumebetween the substrate lower surface 249 and the susceptor pocket uppersurface 229 defined by the protrusion tops 228, as well as the volumewithin the grid grooves 222. For a susceptor designed to support a150-mm wafer, the total enclosed flow volume is preferably between about7.5×10⁻⁶ m³ and 10.0×10⁻⁶ m³ and more preferably between about 8.0×10⁻⁶m³ and 9.0×10⁻⁶ m³. For susceptors designed to support-wafers 200 mm indiameter or larger, the total enclosed flow volume is between 1.3×10⁻⁵m³ and 6.0×10⁻⁵ m³. The total enclosed volume for a susceptor designedto support a 200-mm wafer is preferably between about 1.3×10⁻⁵ m³ and4.0×10⁻⁵ m³, more preferably between about 1.4×10⁻⁵ m³ and 1.6×10⁻⁵ m³(1.506×10⁻⁵ m³ in an exemplary 200-mm susceptor). For a susceptordesigned to support a 300-mm wafer, the total enclosed flow volume ispreferably between about 3.0×10⁻⁵ m³ and 6.0×10⁻⁵ m³, more preferablybetween about 3.5×10⁻⁵ m³ and 4.5×10⁻⁵ m³ (or 4.062×10⁻⁵ m³ in anexemplary 300-mm susceptor).

[0051] For 6-inch or 150-mm wafers, the escape area of the susceptor ispreferably between about 0.1×10⁻⁴ m² and 5.0×10⁻⁴ m² and more preferablybetween about 2.0×10⁻⁴ m² and 3.0×10⁻⁴ m². For 200-mm wafers, the escapearea of the susceptor is preferably between about 2.0×10⁻⁴ m² and4.0×10⁻⁴ m² and more preferably between about 2.5×10⁻⁴ m² and 3.5×10 m²(3.096×10⁻⁴ m² in an exemplary 200-mm susceptor). In another embodimentof the current invention, these parameters are optimized for 12-inch or300-mm wafers. The escape area is preferably between about 3.0×10⁻⁴ m²and 6.0×10⁻⁴ m², more preferably between about 4.0×10⁻⁴ m² and 5.0×10⁻⁴m² (4.643×10⁻⁴ m² in an exemplary 300-mm susceptor).

[0052] In the preferred embodiment, a susceptor with a flat pocketsurface is machined from graphite. The susceptor is coated with siliconcarbide at an elevated temperature, preferably between about 1000C. and1500C., more preferably between 1250C. and 1350C. As the susceptor coolsdown the mismatch in thermal expansion coefficient between the graphiteand the silicon carbide cause the susceptor to bend, causing theconcavity of the pocket surface. This embodiment is meant to illustratea preferred method of introducing concavity into the susceptor pocketsurface. The skilled artisan will find other methods for producingconcavities according to the preferred embodiments described above.

[0053] The introduction of concavity into the susceptor surface, alongwith deeper and wider grooves, produces the total enclosed flow volume.This flow volume, along with the escape area (total cross-sectional areaof the groove openings at the wafer perimeter), can accommodate thesudden drop of a wafer without creating a compressed cushion of gas withenough pressure to cause the wafer to skate or slide. In part, theenlarged flow volume assists in absorbing the compression of gas withoutexcessive pressurization and, in part, the escape area enables the gasto escape quickly so that not enough of a cushion is created upondrop-off to even temporarily support the wafer. The wafer rests upon thesupport grid in the centered location for which the wafer transfer robotwas programmed.

[0054] In addition, using the pocket profiles of the preferredembodiments, no significant suction effect is created between the waferand the susceptor when the wafer is picked up by a robot end effector,such as a Bernoulli wand. This improvement in pick-up reduces particlegeneration.

[0055] Advantageously, the preferred flow volumes and escape areas areachieved without creating a sharp thermal transition, such as a ledge,in the susceptor. Thus, the grid continues to extend beneath the entirewafer surface, and the small space between the central protrusions andthe wafer has no adverse effect on the thermal interaction between thewafer and the susceptor. In fact, improvements in film depositionuniformity and repeatability are achieved due to more consistentplacement of the wafer with respect to the susceptor, such thattemperature tuning applies equally well to multiple wafers sequentiallyprocessed. In contrast, prior susceptor designs showed localized coldspots when the wafer slid into contact with the pocket edge. Repeatedtests of depositions performed on a wafer supported by a griddedsusceptor in accordance with the preferred embodiments showed excellentreproducibility and low standard deviation in deposited layer thickness.Table I illustrates the deposition uniformity achieved with the newsusceptors. TABLE I Mean Film Wafer Thickness (Å) Standard Deviation (Å)1 1101 5.5 2 1101 7.0 3 1099 7.2 4 1108 8.2 5 1098 7.2 6 1095 7.2 7 10987.2 8 1094 6.4 9 1090 7.3 10 1095 6.4 11 1100 6.9 12 1094 7.1 13 10886.6 14 1098 7.8 15 1103 6.0 16 1100 7.1 17 1115 8.2 18 1119 8.9 19 11159.8 20 1105 8.9 21 1112 7.5 22 1111 8.6 23 1113 9.8

[0056] Moreover, better control over centered drop-off also avoidedcatastrophic failure in processing. In depositions performed using thepreferred embodiments, no slide was observed; wafers remained centeredas dropped, and the deposited films were within control limits.

[0057] In experiments performed using a gridded susceptor withoutconcavity and with narrower grooves, on the other hand, unacceptablefilms were observed, as indicated in Table II. The wafers in Tables Iand II were processed in the same type of chamber and in a similartemperature range, although the process recipes were not identical.TABLE II Mean Film Wafer Thickness (Å) Standard Deviation (Å) 1 170312.2 2 1706 8.4 3 1724 10.1 4 1662 48.6 5 1709 7.9 6 1706 12.3 7 163545.0 8 1635 42.8 9 1709 8.7 10 1709 11.4 11 1709 8.2 12 1705 11.3 131720 7.2 14 1706 8.7 15 1611 53.2 16 1635 44.8 17 1709 7.5 18 1701 13.519 1711 15.0 20 1705 16.6 21 1697 16.3 22 1709 10.1

[0058] Wafers 4, 7, 8, 16 and 17, had radically higher standarddeviations and therefore, much greater variation in film thickness ascompared to the wafers in Table I. This is an indication that waferslide to contact the shoulder 206 of the susceptor 200 has occurred forthese wafers. A significant temperature differential due to this contactresults in varying deposition rates across the wafer 16 and, therefore,a non-uniform film thickness.

[0059] Additionally, the concavity 246 (FIG. 4) in the susceptor uppersurface 229 reduced the occurrence of wafer curl. With reference to FIG.2, when initially introduced into the chamber 12 and held over thesusceptor 200, a wafer 16 is heated disproportionately from below.Accordingly, the hotter temperature on the bottom surface of the wafer16 results in greater thermal expansion on the bottom surface and,therefore, in a slight amount of upward curl. The wafer has a bowl orconcave shape with a concavity on the order of about 0.010 inch.Concavity in this context refers to the depth from the highest point ofthe wafer (generally the edge) to the lowest point of the wafer(generally the center). If dropped onto a “flat” gridded susceptor, thecenter of the wafer 16 first contacts the susceptor, introducing radialtemperature gradients. This quickly exacerbates the curl effect, suchthat the concavity increases to about 0.350 inch upon contact, oftenscratching the end effector before it can be withdrawn and sometimesresulting in breaking of the wafer.

[0060] In contrast, the susceptor concavity in the preferred embodimentsmakes a susceptor that conforms better to the shape of the slightlycurled wafer when the wafer is dropped off, thus making more continuousthermal contact therewith. Wafer curl is reduced to a concavity of about0.200 inch, which is insufficient to scratch the Bernoulli wand. Byavoiding wand scratching and attendant particle problems, yield has beenshown to improve by 30% to 40%.

[0061]FIGS. 7A and 7B illustrate a susceptor 200 constructed inaccordance with another embodiment, whereby centering is improved, andthermal non-uniformity from contacting the wall at the edge of thepocket 202 is avoided. The illustrated embodiment also contains agridded susceptor, such that similar elements to those of the previousembodiment will be referenced by like reference numbers.

[0062] The susceptor 200 includes a central gridded pocket 202, on whicha wafer can be positioned, and a plurality of centering locators 250 or252 on the periphery of the pocket 202. The locators 250 or 252 extendabove the level of the grid and keep the wafer from coming into contactwith the annular shoulder 206, which would cause cooling at the waferedge, as mentioned above. The wafer edge can make contact with thelocators 250 or 252, so the locators 250 or 252 are designed to minimizeany adverse thermal impact this might have. The centering locator 250 ofFIG. 7A has contact with the annular shoulder 206 along only thesmallest side of the locator. Leaving a space between the centeringlocators and the annular shoulder, as shown in FIG. 7B is the preferredarrangement, but even centering locators attached to the annularshoulder 206 as shown in FIG. 7A, are an improvement over risking wafercontact with the annular shoulder 206 itself. The narrow locators keepthe wafer away from the much greater thermal mass of the annularshoulder 206, where the cooling effect would be great.

[0063] The width of each locator along a circumference of the recess, oralong surfaces 260, 262 in FIGS. 7A and 7B, respectively, is less thanabout 1.50 mm. The upper surfaces of the locators are about level withthe upper surface of the annular shoulder 206. In FIG. 7A, the radiallength of each locator at its upper surface is preferably between about1.00 and 2.00 mm. In FIG. 7B, the outer edge 258 of each locator isspaced between about 0.50 mm and 2.00 mm from the inner circumference ofthe annular shoulder 206.

[0064] The locators 250 and 252 are positioned with their inner edges260 and 262, respectively, along a circle with a diameter slightlylarger than the diameter of the wafer. Preferably, there are between 6and 10 locators, more preferably between about 7 and 9 locators, andmost preferably about 8 locators spaced evenly around the edge of thepocket 202, as shown in FIG. 8.

[0065] The substrate support described herein contains features thatmake improvements over the prior art for many aspects of substratepositioning in substrate processing systems. In particular, the enclosedflow volume in the susceptor pocket under the substrate and the escapearea around the periphery of the substrate have been designed to reducethe possibility of substrate slide and stick during drop off and pickup. This ensures that the substrate is positioned near the center of thesusceptor pocket during processing. In another embodiment, centeringlocators around the edge of the susceptor pocket reduce further thepossibility of contact between the substrate and the outer edge of thesusceptor. These features of the susceptor pocket prevent contactbetween the edge of the substrate and the cooler outer shoulder of thesubstrate holder, thereby helping to achieve temperature uniformity andensuring that the quality of the process result has good repeatibility.

[0066] It will be appreciated by those skilled in the art that variousmodifications and changes may be made without departing from the scopeof the invention, and all such modifications and changes are intended tofall within the scope of the invention, as defined by the appendedclaims.

I claim:
 1. A method of manufacturing a substrate holder to preventslide of a substrate during drop off comprising: forming an annularshoulder around a recessed pocket in a material capable of absorbingradiant energy; and forming an upper surface of the pocket as a concavesupport surface configured to underlie a supported substrate, thesupport surface having a concavity between about 0.130 mm and 0.500 mmin depth measured from a peripheral edge of the concave support surfaceto a central point within the concave support surface; and cuttingcrossing grid grooves into the concave surface.
 2. The method of claim1, wherein the recessed pocket and support surface are sized to receivea 200-mm substrate and the concavity is between about 0.130 mm and 0.250mm in depth.
 3. The method of claim 2, wherein the concavity is betweenabout 0.170 mm and 0.220 mm in depth.
 4. The method of claim 1, whereinthe recessed pocket and support surface are sized to receive a 300-mmsubstrate and the concavity is between about 0.300 mm and 0.500 mm indepth.
 5. The method of claim 4, wherein the concavity is between about0.360 mm and 0.400 mm in depth.
 6. The method of claim 1, whereincutting the grid grooves comprises machining to a depth of between about0.35 mm and 0.55 mm with a pitch between adjacent features between about1.0 mm and 1.5 mm.
 7. The method of claim 1, wherein the recessed pocketand support surface are sized to receive a 300-mm substrate, and a planeextending across the concave support surface encloses a volume betweenabout 3.0×10−5 m³ and 6.0×10⁻⁵ m³.
 8. The method of claim 1, wherein therecessed pocket and support surface are sized to receive a 200-mmsubstrate, and a plane extending across the concave support surfaceencloses a volume between about 1.3×10⁻⁵ m³ and 4.0×10⁻⁵ m³.
 9. Themethod of claim 1, wherein the recessed pocket and support surface aresized to receive a 150-mm substrate, and a plane extending across theconcave support surface encloses a volume between about 7.5×10⁻⁶ m³ and10.0×10⁻⁶ m³.
 10. A method of maintaining process temperature at anouter periphery of a substrate positioned in a recess on a surface of asubstrate holder, the method comprising providing a plurality ofcentering locators spaced around an outer edge of the recess and locatedto center the substrate within the recess, each centering locator havingan inner surface which is spaced radially inward from an annularshoulder that defines the outer edge of the recess, providing each ofthe centering locators with a circumferentially thin dimension so thatthe outer periphery of the substrate engaging the centering locator hasno direct contact with the shoulder.
 11. The method of claim 10,including spacing an outer edge of each of the centering locatorsinwardly from the annular shoulder to thermally decouple the centeringlocators from the shoulder.
 12. The method of claim 10, includingspacing an outer edge of the recess below an upper surface of theannular shoulder by a distance about equal to a thickness of thesubstrate positioned in the recess.
 13. The method of claim 10,including providing a grid on the surface of the substrate holder in therecess, the grid containing a plurality of intersecting grid grooves andprotrusions.